华勤技术-智能硬件_ODM

Product features

General purpose

2 DW GPU

CPU	2x Intel® Ice Lake SP; Max. 40 cores each, 270W TDP (300W CPU requires dedicated cooler)
Memory	32x DDR4 DIMM Slots, Up to 3200MT/s
Integrated Network Ports	2x 1GbE Port(with shared IPMI) 1x 1GbE dedicate IPMI Port
Storage	Front: 12x LFF SATA/SAS Drive slot (4 slot could be anybay,兼容SFF) Rear: 4x SFF SAS/SATA/Nvme Drive Slot 4x LFF SATA/SAS Drive slot	Front: 12x LFF SATA/SAS Drive slot (4 slot could be anybay,兼容SFF) Rear: 4x SFF SAS/SATA/Nvme Drive Slot
PCIe slots	Max 8x PCIe Card + 1x OCP 3.0 Riser 1: FHHLx16 + FHHLx8 + FHHLx8 Riser 2: FHFLx16 + FHFLx8 + FHHLx8 Riser 3: FHHLx8 + FHHLx8 SFF OCP3.0(x16 PCIe)	Max 6x PCIe Card + 1x OCP 3.0 Riser 1: FHHLx16 + FHHLx8 Riser 2: FHFLx16 + FHFLx8 Riser 3: FHHLx8 + FHHLx8 SFF OCP3.0(x16 PCIe)
Low-speed IO	2x Front & 2x Rear USB 3.0, Type-A 1x PWR BTN with LED 1x Front UID BTN with LED + 1x Rear UID LED 1x Front VGA +1x Rear VGA 1x Rear COM port(RJ45)
Out-of-band management	IPMI 2.0 management, ASPEED AST2500 BMC
Out-of-band management	TPM header for TPM2.0/TCM2.0
Power supply	1+1 Redundant 185mm CRPS 800W/1300W/1600W 90 V~264 V AC or 200 V ~ 300 V DC
System Fan	4x 8038
Operating Temperature	5~35℃
Dimension	87mm (H) x 436mm (W) x 815mm (D)
Dimension	87mm (H) x 436mm (W) x 815mm (D)	87mm (H) x 436mm (W) x 815mm (D)