1.Radio Frequency (RF)

By optimizing the front-end circuit design, selecting high-performance power amplifiers, and achieving precise impedance matching, we significantly improve RF performance. This ensures stable communication even in complex environments; meanwhile, we adopt intelligent sensing algorithms to realize seamless switching between dual-band (e.g., Wi-Fi) and provide users with high-quality, stable network experience in all scenarios.

2.Antenna Design

We have overcome the challenges of clearance space and screen ratio. Through refined structural design and material optimization, we achieve efficient integration of antennas with the device body. The small-clearance antenna design, combined with differentiated solutions, not only meets the demand for higher screen ratio but also ensures stable signal transmission, balancing product performance and appearance design.

3.Circuit Design

We possess industry-leading circuit integration capabilities, enabling efficient layout of complex circuits in a minimal motherboard area. We can integrate more than 1,200 components while effectively resolving inter-module interference, providing compact and reliable circuit solutions to support the stable operation of various types of products.

4.Sensor

We realize efficient integration of sensors in scenarios such as wearable devices and audio equipment, supporting functions such as blood pressure collection and noise cancellation. With precise circuit control and medical-grade certification, we balance miniaturization and practicality, significantly enhancing user experience.

5.High-Speed Interconnection

We have achieved mass production and application of 112Gbps SerDes technology, with 224Gbps SerDes solutions ready for deployment. We are also developing 448Gbps technology to meet the high-bandwidth and low-latency requirements of data centers and AI applications, supported by advanced interconnection architectures and low-loss designs.

1.Multi-System and Multi-Platform Solution Design and Development

We have strong optimization and adaptation capabilities for multiple operating systems such as Android and Windows, and can carry out underlying software development and debugging for various architectures (Arm, x86, Linux). Covering mainstream chip platforms such as Intel, AMD, Qualcomm, and NVIDIA, we ensure seamless and stable operation of products in various environments through professional system integration, performance optimization, and compatibility testing.

2.Embedded Software Architecture

We have built a full-link embedded software architecture from firmware development to application integration. Our team is proficient in multiple processor cores (8051, RISC-V, ARM) and various embedded operating systems (Lite OS, Linux), providing efficient and stable embedded solutions for PCs, automotive electronics, robots, and other products, while offering reliable controller support for various peripheral devices.

1.Slim Architecture

Focusing on product slimness, we optimize from three dimensions: architecture design, component miniaturization, and process improvement. The thickness of tablet products can be as low as 5.79mm, ensuring product strength and reliability while maximizing portability, perfectly meeting market demand for lightweight and convenient products.

2.Functional Waterproofing

Covering a variety of product categories, we support waterproof grades from daily life waterproofing to IP68 level, adapting to different usage scenarios. Through structural design optimization and advanced process application, we build a comprehensive waterproof barrier to ensure stable product operation in complex environments, while achieving cost control without additional production costs.

3.Thermal Management

Adopting a combination of active and passive cooling, we optimize fan technology and vapor chamber design to reduce device operating temperature. We provide efficient heat dissipation solutions for data infrastructure and AI equipment, ensuring long-term stable operation of devices while meeting energy-saving requirements.

4.Innovative Processes

We focus on process upgrading to solve core industry pain points, improving product quality and user experience through advanced material application and mold optimization. We continuously innovate in mold design and material selection to enhance core product competitiveness and meet user needs.