

Huaqin Story
This is more than just our story. This is twenty years of the Huaqin journey.
The Journey of Technological Innovation
Research and innovation are at the heart of Huaqin’s DNA. From our early days of achieving breakthroughs through differentiated innovation to the establishment of five core research labs today, we have never stopped exploring over the past two decades. By applying cutting-edge technologies to our products, we turn innovation into tangible outcomes — making technology accessible through smart devices and improving the way people communicate and live.

2G
2005-2009 Mobile IDH
ID&CMF Design
Huaqin has developed design solutions and highly integrated PCBA motherboards for feature phones since 2005.
Circuit Design
Feature phones had physical keys, cool lighting, and multiple speakers, providing simple functions and excellent PCBA compatibility. The PCBs were mainly HDI+1 design or through hole PCBs.
RF & Antenna Design
RF technology is relatively simple, with single-band antenna design for GSM. The hardware is bulky and has limited RF efficiency and antenna gain, but it meets basic voice and SMS needs.
Thermal Design
From the 2G to 4G era, mobilephone thermal design shifted from passive to active cooling using graphite and metal sheets for better heat dissipation.
Laptop thermal design evolved from single fan to multi-heat pipes and multi-fan systems, focusing on the system performance improvement with better cooling and portability.
Server thermal design has evolved from air cooling to advanced liquid cooling solutions and heat pipes for high-density computing needs.
Laptop thermal design evolved from single fan to multi-heat pipes and multi-fan systems, focusing on the system performance improvement with better cooling and portability.
Server thermal design has evolved from air cooling to advanced liquid cooling solutions and heat pipes for high-density computing needs.
Software Development
Innovative development based on Turnkey
3G 4G
2010-2014 Mobile Phone ODM
ID&CMF Design
At the complete phone design stage, products focus on aesthetics, utilizing metals and glass to enhance durability and appearance.
Circuit design
From 2G to 3G, the gradual transition to smartphones increased PCB layout density and reduced pitch spacing of main chips, making HDI+2 design the mainstream solution.
RF & Antenna design
RF tech becomes more complex with multi-band/mode antennas and WCDMA application. Hardware is miniaturized, improving RF performance , and antenna designs are developed for multi-band & MIMO technology.
Thermal design
From the 2G to 4G era, mobilephone thermal design shifted from passive to active cooling using graphite and metal sheets for better heat dissipation.
Laptop thermal design evolved from single fan to multi-heat pipes and multi-fan systems, focusing on the system performance improvement with better cooling and portability.
Server thermal design has evolved from air cooling to advanced liquid cooling solutions and heat pipes for high-density computing needs.
Laptop thermal design evolved from single fan to multi-heat pipes and multi-fan systems, focusing on the system performance improvement with better cooling and portability.
Server thermal design has evolved from air cooling to advanced liquid cooling solutions and heat pipes for high-density computing needs.
Software development
Customized system development
Internet of Everything
2015-2019 Multi-category Intelligent Terminal ODM
ID & CMF Design
Products slim down with metals and glass, improving touch and visuals. Notebooks and tablets trend towards thinness. Smart wearables like watches prioritize comfort and aesthetics.
Circuit Design
Layout area is adjusted as the number of RF antennas increases to maximize placement efficiency, leading to the development of sandwich PCB structure layouts.
RF & Antenna Design
RF tech evolves, with complex antennas for LTE and multiple bands, using MIMO technology to improve transmission rates and signal quality, and the RF module integration is improved.
Thermal Design
In 2015, Huaqin entered notebook business, focusing on copper/aluminum natural cooling and single-fan air cooling solutions; for entry-level dedicated graphics cards, a dual-heat-pipe single-fan solution was employed.
In 2017, Huaqin expanded into data center products, adopting a combination of heat pipe coolers and profile coolers for mainstream 2U standard servers to achieve optimal performance and cost efficiency.
In 2017, Huaqin expanded into data center products, adopting a combination of heat pipe coolers and profile coolers for mainstream 2U standard servers to achieve optimal performance and cost efficiency.
Software Development
Design and development for software solutions
2020-Present Intelligent Product Platform
ID & CMF Design
Product categories diversify into smart wearables, servers, automotive electronics, and more, with material innovations such as ceramics and titanium alloys, emphasizing seamless connectivity and quick response. Smart terminal products integrate more sensors to enhance interaction.
Circuit Design
Leveraging our experience in ODM, we have expanded into wearables, servers, and automotive sectors. Mainboard designs increasingly require smaller sizes, higher speeds, and greater integration, with wearables adopting hybrid boards and FOB(FPC to Board)connections.
RF&Antenna Design
RF tech makes a quantum leap with large-scale MIMO and beamforming for mmWave. Highly integrated hardware boosts bandwidth and efficiency for ultra-fast data transfer.
Thermal Design
Laptop:1. The vapor chamber and dual-fan module ensures a cool, quiet system; for devices with dedicated RTX graphics cards, we developed a dual-fan cooling solution with multiple heat pipes.
2. For gamers and pros, complex cooling with multiple heat pipes, dual fans, and multiple air outlets is used.
Server:1. As the TDP of mainstream server chips continues to rise, EVAC, LAAC, and 3DVC cooling solutions are important methods for enhancing the efficiency of air cooling.
2. In the Post-Moore law period, AI chips require the introduction of liquid cooling technology to reduce the PUE and energy consumption of data centers.
2. For gamers and pros, complex cooling with multiple heat pipes, dual fans, and multiple air outlets is used.
Server:1. As the TDP of mainstream server chips continues to rise, EVAC, LAAC, and 3DVC cooling solutions are important methods for enhancing the efficiency of air cooling.
2. In the Post-Moore law period, AI chips require the introduction of liquid cooling technology to reduce the PUE and energy consumption of data centers.
Software Development
Multi-system, Multi-platform, Full-stack Development
AI
AI
ID & CMF Design
Smart products increasingly achieve higher integration and personalization. AI-driven interactions, along with eco-friendly and adaptive materials, enhance user-centered design for a pleasant experience that is sustainable and interconnected.
Circuit Design
Intelligent products feature ultra-high data transfer rates, highly intelligent features, and AI integration. The increased requirements for board layout and integration demand extremely dense routing, utilizing anylayer PCBs and MSAP(Modified Semi-Additive Process).
RF & Antenna Design
Huaqin is utilizing its 5G technology to drive advancements in 6G communications and native AI, propelling the industry towards the Internet of Everything, cloud computing, smart buildings, and automotive intelligence, further strengthening its competitiveness in 6G communication fields such as sensory integration and integrated space-air-ground.
Thermal Design
1. Intelligent temperature control: AI algorithms combined with external camera-based scene recognition are used to independently and accurately refine and improve cooling solutions.
2. Nanotechnology: In future cooling systems, nanomaterials and nanostructures could be employed to achieve greater heat dissipation efficiency.
3. Internal Recirculating Liquid Cooling: Integrating the external recirculating liquid cooling solution within the laptop system to enhance the laptop's inherent cooling capacity.
4. Immersion cooling: The heat output from electronic components is removed through heat exchange, using a specialized fluid material as the medium, achieving over 50% energy savings and emission reductions compared to conventional air cooling systems.
2. Nanotechnology: In future cooling systems, nanomaterials and nanostructures could be employed to achieve greater heat dissipation efficiency.
3. Internal Recirculating Liquid Cooling: Integrating the external recirculating liquid cooling solution within the laptop system to enhance the laptop's inherent cooling capacity.
4. Immersion cooling: The heat output from electronic components is removed through heat exchange, using a specialized fluid material as the medium, achieving over 50% energy savings and emission reductions compared to conventional air cooling systems.
Software Development
Multi-system, Multi-platform, Full-stack Development
Highlight Video
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Two Decades of Huaqin
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Huaqin Social Good Initiative
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Huaqin Corporate Video
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20th Anniversary Celebration
Celebrating Two Decades
On August 29th, Huaqin Technology will celebrate its 20th birthday.
In its second decade, Huaqin is like a young growing tree.
Though not yet a towering giant, its roots run deep.
It stands unshaken by wind and rain, and thrivers with unceasing vitality.
